3D PLUS is a world-leading supplier of advanced high-density 3D microelectronic products and die/wafer stacking technology. Their products meet the demand for high reliability, high performance, and very small size in today’s and tomorrow’s electronics.
3D PLUS has been recognized for its innovation in the design and manufacturing of miniaturized 3D modules for more than 25 years. Their technology enables stacking heterogeneous active, passive, and opto-electronic devices in a single highly miniaturized package.
3D PLUS offers high reliability and high-performance innovative products thanks to a strong design activity of complex electronic modules and a high level of technical capability in various areas such as digital, analog, and IP CORES. These abilities, combined with a strong Space Radiation expertise, enable them to bring key advantages for all kinds of space missions with a very high level of guarantee.
3D PLUS standard products and custom solutions bring breakthrough advantages to their customers’ electronic designs. They are used in diverse computer boards, data recorders boards, and custom applications for buses and payloads. Their flight heritage is expanding continuously with products launched in Space every month in GEO, MEO, and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions.
